- 您现在的位置：买卖IC网 > Sheet目录855 > CM21X5R106K06AL (AVX Corporation)CAP CER 10UF 4V 10% X5R 0805
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
Recommended chip position on PCB to minimize stress from PCB warpage
(Not recommended)
(Ideal)
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
(Not recommended)
(Ideal)
Crack
Support pin
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use
a low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
CM453232-680KL
INDUCTOR CHIP 68UH 10% 1812 SMD
CMH322522-R82ML
INDUCTOR 820NH 450MA SMD
CMR05F101JODR
CAP MICA 100PF 500V 5% RADIAL
CR-1025/BN
BATTERY LITHIUM COIN 3V 10MM
CR-1220/HFN
BATTERY LITHIUM COIN 3V PC PINS
CR-123APA/1B
BATT 3V LITH CAMERA - RETAIL PKG
CR-1612/BN
BATTERY LITHIUM COIN 3V 16MM
CR-1616/F2N
BATTERY LITHIUM COIN 3V W/TAB
相关代理商/技术参数
CM21X5R106K06AT
制造商:AVX Corporation 功能描述:MLCC 0805 X5R 10U 6.3V 10% 制造商:Kyocera 功能描述:6.3V 10uF }10% 2012
CM21X5R106K10AT
制造商:AVX Corporation 功能描述:MLCC 0805 X5R 10UF 10V +-10%
CM21X5R106K16AT
制造商:AVX Corporation 功能描述:MLCC 0805 X5R10U 16V 10% 制造商:KYOCERA Corporation 功能描述:
CM21X5R106M06AT
制造商:AVX Corporation 功能描述:CHIP CAPACITOR
CM21X5R225K06AT
制造商:AVX Corporation 功能描述:
CM21X5R225K10AT
制造商:AVX Corporation 功能描述:MLCC 0805 X5R 2.2uF 10% 10VDC
CM21X5R225K16AB
制造商:Kyocera 功能描述:16V 2.2uF }10% 2.0~1.2~1.25mm X5R +85 -55 2.0mm 1.2mm 1.25mm Cut Tape 制造商:Kyocera 功能描述:Cap Ceramic 2.2uF 16V X5R 10% SMD 0805 85°C Bulk
CM21X5R225K25AT
制造商:AVX Corporation 功能描述:MLCC 2.2UF X5R 25V 10% 0805